u'Buffer overflow while processing a crafted PDU data packet in bluetooth due to lack of check of buffer size before copying' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, QCA6390, QCN7605, QCN7606, SA415M, SA515M, SA6155P, SA8155P, SC8180X, SDX55
References
Link | Resource |
---|---|
https://www.qualcomm.com/company/product-security/bulletins/october-2020-bulletin | Broken Link |
https://www.qualcomm.com/company/product-security/bulletins/october-2020-security-bulletin | Vendor Advisory |
History
No history.
MITRE Information
Status: PUBLISHED
Assigner: qualcomm
Published: 2020-11-02T06:21:22
Updated: 2020-11-02T06:21:22
Reserved: 2020-03-31T00:00:00
Link: CVE-2020-11154
JSON object: View
NVD Information
Status : Analyzed
Published: 2020-11-02T07:15:13.593
Modified: 2020-11-03T17:41:56.583
Link: CVE-2020-11154
JSON object: View
Redhat Information
No data.
CWE