Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
History

No history.

cve-icon MITRE Information

Status: PUBLISHED

Assigner: qualcomm

Published: 2020-07-30T11:40:27

Updated: 2020-07-30T11:40:27

Reserved: 2019-07-19T00:00:00


Link: CVE-2019-14037

JSON object: View

cve-icon NVD Information

Status : Analyzed

Published: 2020-07-30T12:15:11.333

Modified: 2020-07-31T13:55:19.537


Link: CVE-2019-14037

JSON object: View

cve-icon Redhat Information

No data.

CWE