CVE-2017-18305 - OpenCVE

XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835.

No CVSS v3.1

Attack Vector Local

Attack Complexity High

Privileges Required Low

Scope Unchanged

Confidentiality Impact High

Integrity Impact High

Availability Impact High

User Interaction None

Access Vector Local

Access Complexity Medium

Authentication None

Confidentiality Impact Complete

Integrity Impact Complete

Availability Impact Complete

AV:L/AC:M/Au:N/C:C/I:C/A:C

Vendors & Products
CPE Configurations

Vendors	Products
Qualcomm	Sd 212 Firmware Mdm9650 Sd 205 Firmware Mdm9607 Firmware Sd 835 Firmware Mdm9206 Firmware Mdm9206 Mdm9607 Sd 212 Sd 210 Mdm9650 Firmware Sd 205 Sd 835 Sd 210 Firmware

Configuration 1 [-]

AND

cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*

Configuration 2 [-]

AND

cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*

Configuration 3 [-]

AND

cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*

Configuration 4 [-]

AND

cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*

Configuration 5 [-]

AND

cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*

Configuration 6 [-]

AND

cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*

Configuration 7 [-]

AND

cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*

References

Link	Resource
http://www.securitytracker.com/id/1041432	Third Party Advisory VDB Entry
https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components	Third Party Advisory
https://www.qualcomm.com/company/product-security/bulletins	Vendor Advisory

History

No history.

MITRE Information

Status: PUBLISHED

Assigner: qualcomm

Published: 2018-10-23T13:00:00

Updated: 2018-10-24T09:57:01

Reserved: 2018-06-15T00:00:00

Link: CVE-2017-18305

JSON object: View

NVD Information

Status : Analyzed

Published: 2018-10-23T13:29:02.557

Modified: 2019-10-03T00:03:26.223

Link: CVE-2017-18305

JSON object: View

Redhat Information

No data.

CWE

NVD-CWE-noinfo

{"containers": {"cna": {"affected": [{"product": "Snapdragon Mobile, Snapdragon Wear", "vendor": "Qualcomm, Inc.", "versions": [{"status": "affected", "version": "MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835"}]}], "datePublic": "2018-08-06T00:00:00", "descriptions": [{"lang": "en", "value": "XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835."}], "problemTypes": [{"descriptions": [{"description": "Improper Access Control in Core", "lang": "en", "type": "text"}]}], "providerMetadata": {"dateUpdated": "2018-10-24T09:57:01", "orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f", "shortName": "qualcomm"}, "references": [{"tags": ["x_refsource_CONFIRM"], "url": "https://www.qualcomm.com/company/product-security/bulletins"}, {"name": "1041432", "tags": ["vdb-entry", "x_refsource_SECTRACK"], "url": "http://www.securitytracker.com/id/1041432"}, {"tags": ["x_refsource_CONFIRM"], "url": "https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components"}], "x_legacyV4Record": {"CVE_data_meta": {"ASSIGNER": "product-security@qualcomm.com", "ID": "CVE-2017-18305", "STATE": "PUBLIC"}, "affects": {"vendor": {"vendor_data": [{"product": {"product_data": [{"product_name": "Snapdragon Mobile, Snapdragon Wear", "version": {"version_data": [{"version_value": "MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835"}]}}]}, "vendor_name": "Qualcomm, Inc."}]}}, "data_format": "MITRE", "data_type": "CVE", "data_version": "4.0", "description": {"description_data": [{"lang": "eng", "value": "XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835."}]}, "problemtype": {"problemtype_data": [{"description": [{"lang": "eng", "value": "Improper Access Control in Core"}]}]}, "references": {"reference_data": [{"name": "https://www.qualcomm.com/company/product-security/bulletins", "refsource": "CONFIRM", "url": "https://www.qualcomm.com/company/product-security/bulletins"}, {"name": "1041432", "refsource": "SECTRACK", "url": "http://www.securitytracker.com/id/1041432"}, {"name": "https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components", "refsource": "CONFIRM", "url": "https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components"}]}}}}, "cveMetadata": {"assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f", "assignerShortName": "qualcomm", "cveId": "CVE-2017-18305", "datePublished": "2018-10-23T13:00:00", "dateReserved": "2018-06-15T00:00:00", "dateUpdated": "2018-10-24T09:57:01", "state": "PUBLISHED"}, "dataType": "CVE_RECORD", "dataVersion": "5.0"}

{"configurations": [{"nodes": [{"cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*", "matchCriteriaId": "A960B86A-C397-4ACB-AEE6-55F316D32949", "vulnerable": true}], "negate": false, "operator": "OR"}, {"cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*", "matchCriteriaId": "D79B8959-3D1E-4B48-9181-D75FE90AAF98", "vulnerable": false}], "negate": false, "operator": "OR"}], "operator": "AND"}, {"nodes": [{"cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*", "matchCriteriaId": "A35FECFB-60AE-42A8-BCBB-FEA7D5826D49", "vulnerable": true}], "negate": false, "operator": "OR"}, {"cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*", "matchCriteriaId": "E9765187-8653-4D66-B230-B2CE862AC5C0", "vulnerable": false}], "negate": false, "operator": "OR"}], "operator": "AND"}, {"nodes": [{"cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*", "matchCriteriaId": "35B7E25E-FA92-4C36-883C-CFF36F4B3507", "vulnerable": true}], "negate": false, "operator": "OR"}, {"cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*", "matchCriteriaId": "ECD99C6F-2444-4A5E-A517-0C8023DDF23D", "vulnerable": false}], "negate": false, "operator": "OR"}], "operator": "AND"}, {"nodes": [{"cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*", "matchCriteriaId": "0FA80D57-3191-47CF-AD3F-9F2D64E443FE", "vulnerable": true}], "negate": false, "operator": "OR"}, {"cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*", "matchCriteriaId": "B2AFB212-F01A-4CEB-8DB4-2E0CC2308CB6", "vulnerable": false}], "negate": false, "operator": "OR"}], "operator": "AND"}, {"nodes": [{"cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*", "matchCriteriaId": "E0986EF1-0974-488E-84C4-6880F876CE55", "vulnerable": true}], "negate": false, "operator": "OR"}, {"cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*", "matchCriteriaId": "8C08BA58-2EBC-4A22-85A4-2ECD54693B9B", "vulnerable": false}], "negate": false, "operator": "OR"}], "operator": "AND"}, {"nodes": [{"cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*", "matchCriteriaId": "27110478-4C08-49E6-BD53-8BAAD9D5BD65", "vulnerable": true}], "negate": false, "operator": "OR"}, {"cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*", "matchCriteriaId": "3664D302-D22A-4B25-B534-3097AE2F8573", "vulnerable": false}], "negate": false, "operator": "OR"}], "operator": "AND"}, {"nodes": [{"cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*", "matchCriteriaId": "1CFF35A3-1472-4665-9DAB-1ABC45C0D5B4", "vulnerable": true}], "negate": false, "operator": "OR"}, {"cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*", "matchCriteriaId": "F930E9BF-C502-49C6-8BE8-9A711B89FA1B", "vulnerable": false}], "negate": false, "operator": "OR"}], "operator": "AND"}], "descriptions": [{"lang": "en", "value": "XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835."}, {"lang": "es", "value": "La llamada del sistema XBL sec mem dump permite el control total de EL3 desbloqueando todos los XPU si no se se sobrecarga un fusible \"enable\" en Snapdragon Mobile y Snapdragon Wear en versiones MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205 y SD 835."}], "id": "CVE-2017-18305", "lastModified": "2019-10-03T00:03:26.223", "metrics": {"cvssMetricV2": [{"acInsufInfo": false, "baseSeverity": "MEDIUM", "cvssData": {"accessComplexity": "MEDIUM", "accessVector": "LOCAL", "authentication": "NONE", "availabilityImpact": "COMPLETE", "baseScore": 6.9, "confidentialityImpact": "COMPLETE", "integrityImpact": "COMPLETE", "vectorString": "AV:L/AC:M/Au:N/C:C/I:C/A:C", "version": "2.0"}, "exploitabilityScore": 3.4, "impactScore": 10.0, "obtainAllPrivilege": false, "obtainOtherPrivilege": false, "obtainUserPrivilege": false, "source": "nvd@nist.gov", "type": "Primary", "userInteractionRequired": false}], "cvssMetricV30": [{"cvssData": {"attackComplexity": "HIGH", "attackVector": "LOCAL", "availabilityImpact": "HIGH", "baseScore": 7.0, "baseSeverity": "HIGH", "confidentialityImpact": "HIGH", "integrityImpact": "HIGH", "privilegesRequired": "LOW", "scope": "UNCHANGED", "userInteraction": "NONE", "vectorString": "CVSS:3.0/AV:L/AC:H/PR:L/UI:N/S:U/C:H/I:H/A:H", "version": "3.0"}, "exploitabilityScore": 1.0, "impactScore": 5.9, "source": "nvd@nist.gov", "type": "Primary"}]}, "published": "2018-10-23T13:29:02.557", "references": [{"source": "product-security@qualcomm.com", "tags": ["Third Party Advisory", "VDB Entry"], "url": "http://www.securitytracker.com/id/1041432"}, {"source": "product-security@qualcomm.com", "tags": ["Third Party Advisory"], "url": "https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components"}, {"source": "product-security@qualcomm.com", "tags": ["Vendor Advisory"], "url": "https://www.qualcomm.com/company/product-security/bulletins"}], "sourceIdentifier": "product-security@qualcomm.com", "vulnStatus": "Analyzed", "weaknesses": [{"description": [{"lang": "en", "value": "NVD-CWE-noinfo"}], "source": "nvd@nist.gov", "type": "Primary"}]}