A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
References
History

No history.

cve-icon MITRE Information

Status: PUBLISHED

Assigner: qualcomm

Published: 2019-05-06T22:31:47

Updated: 2019-05-06T22:31:47

Reserved: 2018-02-05T00:00:00


Link: CVE-2017-18157

JSON object: View

cve-icon NVD Information

Status : Analyzed

Published: 2019-05-06T23:29:00.440

Modified: 2019-05-07T15:58:11.660


Link: CVE-2017-18157

JSON object: View

cve-icon Redhat Information

No data.

CWE