Filtered by vendor Qualcomm
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Filtered by product Mdm9206 Firmware
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Total
731 CVE
| CVE | Vendors | Products | Updated | CVSS v3.1 |
|---|---|---|---|---|
| CVE-2018-11866 | 1 Qualcomm | 50 Ipq8074, Ipq8074 Firmware, Mdm9206 and 47 more | 2018-12-07 | N/A |
| Integer overflow may happen in WLAN when calculating an internal structure size due to lack of validation of the input length in Snapdragon Mobile, Snapdragon Wear in version IPQ8074, MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016. | ||||
| CVE-2017-18295 | 1 Qualcomm | 38 Mdm9206, Mdm9206 Firmware, Mdm9607 and 35 more | 2018-12-06 | N/A |
| Possible buffer overflow if input is not null terminated in DSP Service module in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDX20. | ||||
| CVE-2018-11982 | 1 Qualcomm | 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more | 2018-11-23 | N/A |
| In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure. | ||||
| CVE-2018-11287 | 1 Qualcomm | 58 Mdm9206, Mdm9206 Firmware, Mdm9607 and 55 more | 2018-11-23 | N/A |
| In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, incorrect control flow implementation in Video while checking buffer sufficiency. | ||||
| CVE-2018-11285 | 1 Qualcomm | 64 Mdm9206, Mdm9206 Firmware, Mdm9607 and 61 more | 2018-11-23 | N/A |
| In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, while parsing FLAC file with corrupted picture block, a buffer over-read can occur. | ||||
| CVE-2018-11269 | 1 Qualcomm | 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more | 2018-11-23 | N/A |
| In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. | ||||
| CVE-2018-5878 | 1 Qualcomm | 24 Mdm9206, Mdm9206 Firmware, Mdm9607 and 21 more | 2018-09-10 | N/A |
| While sending the response to a RIL_REQUEST_GET_SMSC_ADDRESS message, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear. | ||||
| CVE-2018-11258 | 1 Qualcomm | 42 Mdm9206, Mdm9206 Firmware, Mdm9607 and 39 more | 2018-09-06 | N/A |
| In ADSP RPC in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, a Use After Free condition can occur in versions MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. | ||||
| CVE-2018-5876 | 1 Qualcomm | 48 Mdm9206, Mdm9206 Firmware, Mdm9607 and 45 more | 2018-09-05 | N/A |
| While parsing an mp4 file, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear. | ||||
| CVE-2018-5875 | 1 Qualcomm | 48 Mdm9206, Mdm9206 Firmware, Mdm9607 and 45 more | 2018-09-05 | N/A |
| While parsing an mp4 file, an integer overflow leading to a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear. | ||||
| CVE-2018-5894 | 1 Qualcomm | 48 Mdm9206, Mdm9206 Firmware, Mdm9607 and 45 more | 2018-09-05 | N/A |
| Improper Validation of Array Index in Multimedia While parsing an mp4 file in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, an out-of-bounds access can occur. | ||||
| CVE-2018-5838 | 1 Qualcomm | 52 Mdm9206, Mdm9206 Firmware, Mdm9607 and 49 more | 2018-09-04 | N/A |
| Improper Validation of Array Index In the adreno OpenGL driver in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, an out-of-bounds access can occur in SurfaceFlinger. | ||||
| CVE-2017-18133 | 1 Qualcomm | 14 Mdm9206, Mdm9206 Firmware, Mdm9607 and 11 more | 2018-05-16 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, an out of bound access for ebi channel array can potentially occur. | ||||
| CVE-2017-11011 | 1 Qualcomm | 22 Mdm9206, Mdm9206 Firmware, Mdm9607 and 19 more | 2018-05-16 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 820, SD 835, a Use After Free condition can occur in a communication API. | ||||
| CVE-2018-3593 | 1 Qualcomm | 50 Mdm9206, Mdm9206 Firmware, Mdm9607 and 47 more | 2018-05-15 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, repeated enable/disable eMBMS requests may result in a double free condition. | ||||
| CVE-2017-18125 | 1 Qualcomm | 18 Mdm9206, Mdm9206 Firmware, Mdm9607 and 15 more | 2018-05-14 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SD 845, SD 850, when secure camera is activated it stores captured data in protected buffers. The TEE application which uses secure camera expects those buffers to contain data captured during the current camera session. It is possible though for HLOS to put aside and reuse one or more of the protected buffers with previously captured data during next camera session. Such data reuse must be prevented as the TEE applications expects to receive valid data captured during the current session only. | ||||
| CVE-2017-18072 | 1 Qualcomm | 76 Mdm9206, Mdm9206 Firmware, Mdm9607 and 73 more | 2018-05-14 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9640, MDM9650, QCA4531, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA9377, QCA9378, QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016, the probe requests originated from user's phone contains the information elements which specifies the supported wifi features. This shall impact the user's privacy if someone sniffs the probe requests originated by this DUT. Hence, control the presence of which information elements is supported. | ||||
| CVE-2017-18146 | 1 Qualcomm | 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more | 2018-05-14 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, in some corner cases, ECDSA signature verification can fail. | ||||
| CVE-2017-18139 | 1 Qualcomm | 60 Mdm9206, Mdm9206 Firmware, Mdm9607 and 57 more | 2018-05-11 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, a buffer overflow vulnerability may potentially exist while making an IMS call. | ||||
| CVE-2017-18140 | 1 Qualcomm | 48 Mdm9206, Mdm9206 Firmware, Mdm9607 and 45 more | 2018-05-11 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free condition may potentially occur. | ||||