Filtered by vendor Qualcomm
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Filtered by product Sd210
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Total
211 CVE
| CVE | Vendors | Products | Updated | CVSS v3.1 |
|---|---|---|---|---|
| CVE-2017-18282 | 1 Qualcomm | 28 Mdm9206, Mdm9206 Firmware, Mdm9607 and 25 more | 2019-10-03 | N/A |
| Non-secure SW can cause SDCC to generate secure bus accesses, which may expose RPM access in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 835, SDA660. | ||||
| CVE-2017-18280 | 1 Qualcomm | 42 Mdm9607, Mdm9607 Firmware, Msm8909w and 39 more | 2019-10-03 | N/A |
| In Snapdragon (Automobile, Mobile, Wear) in version MDM9607, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDM429, SDM439, SDM632, Snapdragon_High_Med_2016, when a Trusted Application has opened the SPI/I2C interface to a particular device, it is possible for another Trusted Application to read the data on this open interface by calling the SPI/I2C read function. | ||||
| CVE-2018-11277 | 1 Qualcomm | 40 Msm8909w, Msm8909w Firmware, Msm8996au and 37 more | 2019-10-03 | N/A |
| In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue. | ||||
| CVE-2017-18314 | 1 Qualcomm | 74 Mdm9206, Mdm9206 Firmware, Mdm9607 and 71 more | 2019-10-03 | N/A |
| In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ. | ||||
| CVE-2017-18283 | 1 Qualcomm | 18 Qca9379, Qca9379 Firmware, Sd210 and 15 more | 2019-10-03 | N/A |
| Possible memory corruption when Read Val Blob Req is received with invalid parameters in Snapdragon Mobile in version QCA9379, SD 210/SD 212/SD 205, SD 625, SD 835, SD 845, SD 850, SDA660. | ||||
| CVE-2018-11267 | 1 Qualcomm | 78 Mdm9206, Mdm9206 Firmware, Mdm9607 and 75 more | 2019-03-06 | N/A |
| In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20. | ||||
| CVE-2018-11268 | 1 Qualcomm | 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more | 2019-03-05 | N/A |
| In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. | ||||
| CVE-2018-11982 | 1 Qualcomm | 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more | 2018-11-23 | N/A |
| In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure. | ||||
| CVE-2018-11287 | 1 Qualcomm | 58 Mdm9206, Mdm9206 Firmware, Mdm9607 and 55 more | 2018-11-23 | N/A |
| In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, incorrect control flow implementation in Video while checking buffer sufficiency. | ||||
| CVE-2018-11285 | 1 Qualcomm | 64 Mdm9206, Mdm9206 Firmware, Mdm9607 and 61 more | 2018-11-23 | N/A |
| In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, while parsing FLAC file with corrupted picture block, a buffer over-read can occur. | ||||
| CVE-2018-11269 | 1 Qualcomm | 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more | 2018-11-23 | N/A |
| In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. | ||||